Monday, 14 February 2011

ChipCheck project in the "press"


Bob Willis of SMART Group, (who are partners in the ChipCheck project), has made an informative editorial entitled “Counterfeit components EU project launched” in the Global SMT & Packaging Magazine - Vol. 11 No. 2 February 2011, ISSN 1474 - 0893.

Global SMT is the global assembly journal for SMT and advanced packaging professionals and provides a wealth of information focused towards the electronics manufacturing process. Bob's article gives an overview of the counterfeit component problem and some advice on planning a counterfeit component strategy.

Global SMT & Packaging is a subscription based journal and is free to qualifying subscribers. Click here to subscribe.

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